Haixu Abrasive
Main products: Boron carbide and Boron powder

Haixu Boron Carbide Grinding Powder F2000-B4C Powder

Haixu Boron Carbide Grinding Powder F2000-B4C Powder
Haixu Boron Carbide Grinding Powder F2000 (B4C) is an ultra-fine high-performance abrasive powder developed for ultra-precision grinding, lapping and advanced ceramic sintering. Widely known as black diamond, boron carbide ranks among the world’s hardest synthetic materials, featuring ultra-high hardness, outstanding wear resistance, low density and excellent chemical stability. It delivers far finer and more uniform grinding effects than silicon carbide and white fused alumina, making it a top-choice material for high-end precision processing.

$30,000.00$32,000.00 / MT

Description

Haixu Boron Carbide Grinding Powder F2000-B4C Powder

Haixu Boron Carbide Grinding Powder F2000 (B4C) is an ultra-fine high-performance abrasive powder developed for ultra-precision grinding, lapping and advanced ceramic sintering. Widely known as black diamond, boron carbide ranks among the world’s hardest synthetic materials, featuring ultra-high hardness, outstanding wear resistance, low density and excellent chemical stability. It delivers far finer and more uniform grinding effects than silicon carbide and white fused alumina, making it a top-choice material for high-end precision processing.

Manufactured from high-purity boron carbide raw blocks, our F2000 powder adopts ultra-fine airflow grinding and precise FEPA standard classification technology. The product features concentrated particle size distribution, zero coarse particles and ultra-low impurity content. With excellent fluidity and dispersion, it avoids agglomeration and precipitation during wet grinding and polishing processes, ensuring stable and consistent grinding efficiency for long-term batch production.

As a superfine grinding grade powder, F2000 B4C is specially designed for ultra-smooth surface finishing. It is widely applied in precision lapping of hard alloy molds, sapphire wafers, optical glass, ceramic components and semiconductor accessories. The fine and uniform particles achieve micro-cutting without scratching the workpiece surface, effectively reducing surface roughness and obtaining mirror-grade flawless finishing.

In addition to precision grinding, it serves as an ideal functional filler and sintering material for high-density boron carbide ceramics. It improves ceramic compactness, thermal shock resistance and corrosion resistance. With stable batch quality, high temperature resistance and acid-base inertness, Haixu F2000 B4C powder is a reliable raw material for precision manufacturing and advanced new ceramic industries.

TYPICAL CHEMICAL ANALISIS [%]:

Size-Grit Approx Size(microns) B% C% Fe2O3 B+C%
F60 300-250 78-81 17-22 0.2-0.4 97-99
F80 212-180 78-81 17-22 0.2-0.4 97-99
F100 150-125 78-81 17-22 0.2-0.4 97-99
F120 125-106 78-80 17-22 0.2-0.4 96-98
F150 106-75 78-80 17-22 0.2-0.4 96-98
F180 75-63 78-80 17-22 0.2-0.4 96-98
F230 53.0±3.0um 77-80 17-22 0.3-0.5 96-97
F240 44.5±2.0um 77-80 17-22 0.3-0.5 96-97
F280 36.5±1.5um 77-80 17-22 0.3-0.5 96-97
F320 29.2±1.5um 76-79 17-21 0.3-0.6 95-97
F360 22.8±1.5um 76-79 17-21 0.3-0.6 95-97
F400 17.3±1.0um 75-79 17-21 0.4-0.8 94-96
F500 12.8±1.0um 76-79 18-22 0.3-0.7 94-97
F600 9.3±1.0um 74-78 17-21 0.4-0.9 92-94
F800 6.5±1.0um 74-78 17-21 0.4-0.9 92-94
F1000 4.5±0.8um 75-78 18-22 0.1-0.8 90-94
F1200 3.0±0.5um 75-78 18-22 0.1-0.8 90-94
F1500 2.0±0.4um 75-78 18-22 0.1-0.8 90-94
F2000 1.2±0.3um 75-78 18-22 0.1-0.8 90-94

 

PHYSICAL PROPERTIES

Molecular Weight (g/mol.) Theoretical Density (g/cm3) Melting Point (°C) Boiling Point (°C)
55.25515 2.52 2450-2723 3500
Specific Heat (cal-mol-c) Specific Gravity Knoop Hardness Crystallography
12.5 2.51 2750 Mono-crystalline

 

Haixu Boron Carbide Grinding Powder F2000-B4C Powder TDS

Haixu Boron Carbide Grinding Powder F2000-B4C Powder MSDS